Patent Assignment
Reel/Frame 031999/0953
Assignment of Assignor's Interest
Recorded: 2014-01-17
Received: 2014-01-17
Pages: 4
Assignors
DO, BYUNG TAI
Executed: 2014-01-15
KIM, SUNG SOO
Executed: 2014-01-15
TRASPORTO, ARNEL SENOSA
Executed: 2014-01-15
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Vialess Substrate and Method of Manufacture Thereof
Application:
14/136,513 →
Intrauterine Device with Retrieval Thread
Application:
14/057,297 →