IP Library › Assignment 032005/0621
Patent Assignment
Reel/Frame 032005/0621

Assignment of Assignor's Interest

Recorded: 2014-01-21 Pages: 5
Assignors
GRAF, RICHARD STEPHEN
Executed: 2013-12-17
WEST, DAVID JUSTIN
Executed: 2014-01-02
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Semiconductor TSV device package to which other semiconductor device package can be later attached
Patent: 9,721,852 →
Application: 14/159,449 →
Publication: US 2015/0206863
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: AWEMANE LTD.
Reel/Frame 057991/0960 →
Assignment of Assignor's Interest Aug 4, 2023
From: AWEMANE LTD.
To: BEIJING PIANRUOJINGHONG TECHNOLOGY CO., LTD.
Reel/Frame 064501/0498 →
Assignment of Assignor's Interest Jan 3, 2024
From: BEIJING PIANRUOJINGHONG TECHNOLOGY CO., LTD.
To: BEIJING ZITIAO NETWORK TECHNOLOGY CO., LTD.
Reel/Frame 066565/0952 →