IP Library Assignment 032019/0712
Patent Assignment
Reel/Frame 032019/0712

Change of Name

Recorded: 2014-01-15 Pages: 5
Assignor
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA, JAPAN
Covered Properties (38)
Thermoplastic Polyimide, Polyamide Acid, and Thermally Fusible Laminated Film for Covering Conductive Wires
Patent: 5,668,247 →
Application: 08/167,024 →
Process for Preparing Synthetic Resin Powder Having Improved Blocking Resistance
Patent: 5,541,256 →
Application: 08/262,027 →
Control of Cell Arrangement
Patent: 5,593,814 →
Application: 08/308,204 →
Process for the Preparation of Isobutylene Polymer
Patent: 5,527,870 →
Application: 08/370,386 →
Thermoplastic Polyimide Polymer; Thermoplastic Polyimide Film; Polyimide Laminate; and Method of Manufacturing the Laminate
Patent: 5,621,068 →
Application: 08/381,890 →
Curable Resin Composition
Patent: 5,684,094 →
Application: 08/400,101 →
Method for Decomposing Polysiloxane
Patent: 5,504,235 →
Application: 08/479,194 →
Process for Production of D-Alpha-Amino Acids
Patent: 5,695,968 →
Application: 08/479,638 →
Adsorbent Having a Terminal Hydrazine Group and a Method for Removing Ketoamine-Containing Protein
Patent: 5,821,193 →
Application: 08/557,092 →
Feed for Livestock and Poultry and a Method for Improving Meat and Fat Obtainable from Livestock & Poultry Using the Same
Patent: 5,741,508 →
Application: 08/567,850 →
Curable Composition
Patent: 5,650,467 →
Application: 08/583,954 →
Thermosetting Resin Composition and Method of Manufacturing It from an Epoxy Resin, Cyanate and Phenol
Patent: 5,641,852 →
Application: 08/586,464 →
Absorbent for Removing Interleukins and Tumor Necrosis Factor, and Process for Removing the Same
Patent: 5,919,898 →
Application: 08/590,599 →
Novel Flexible Copper-Coated Laminate and Flexible Printed Circuit Board
Patent: 5,637,382 →
Application: 08/592,480 →
Modified Cross-Section Fiber for Artificial Hair
Patent: 5,683,814 →
Application: 08/624,357 →
Fiber for Artificial Hair Having Excellent Bulkiness
Patent: 5,677,059 →
Application: 08/644,899 →
Resin Composition Excellent in Impact Strength
Patent: 5,798,414 →
Application: 08/656,295 →
Foaming Resin Composition, Plastic Foam Formed from the Composition, and Method for Forming the Plastic Foam
Patent: 5,652,276 →
Application: 08/669,301 →
Additive for Thermpolastic Resins and Flame Retardant Resin Composition
Patent: 5,684,071 →
Application: 08/670,141 →
Method for Adhering or Sealing
Patent: 5,804,253 →
Application: 08/679,670 →
Method of Improving Adhesive Property of Polyimide Film and Polyimidefilm Having Improved Adhesive Property
Patent: 5,861,192 →
Application: 08/690,975 →
Process for Preparing Carboxylic Acid Derivative
Patent: 5,723,628 →
Application: 08/693,229 →
Process for Preparing Carboxylic Acid Derivative
Patent: 5,756,768 →
Application: 08/693,230 →
Substrate of Electrode for Liquid Crystal
Patent: 5,817,383 →
Application: 08/693,256 →
Thermally Fusible Adhesive Coploymer, Articles Made Thereform and Method for Producing the Same
Patent: 5,932,345 →
Application: 08/714,072 →
Film Distinguished in Coriona Resistant Characteristic and Insulated Wires, Coils, and Motors Comprising the Film as an Insulation Material
Patent: 6,194,665 →
Application: 08/736,660 →
Reformed Polyimide Fluorocarbon Resin Laminated Film
Patent: 6,106,949 →
Application: 08/759,682 →
Laminate
Patent: 5,759,693 →
Application: 08/811,366 →
Hydrosilylation Method and Process for Producing Curing Agent Making Use of the Same
Patent: 5,808,127 →
Application: 08/836,694 →
Thin-Film Solar Cell
Patent: 5,828,117 →
Application: 08/859,687 →
Method for Immobilizing Ligand or Compound Having Ligand Bonded Thereto
Patent: 5,866,387 →
Application: 08/894,782 →
Curable Polymer Composition
Patent: 6,300,404 →
Application: 09/011,449 →
Publication: US 2001/0003763
Rubber Latexes, Graft Copolymers, and Thermoplastic Resin Compositions
Patent: 6,136,918 →
Application: 09/068,014 →
Method for Producing Polyimide Film
Patent: 6,264,866 →
Application: 09/095,129 →
Polyimide Composition and Base Tape for Tab Carrier Tape and Flexible Printed Circuit Board Made from Said Composition
Patent: 6,031,068 →
Application: 09/177,375 →
Polyamide Acid Composition Containing Metal, Polyimide Film, Flexible Printed Wiring Board and Method for Producing Them
Patent: 6,207,739 →
Application: 09/196,310 →
Adsorbent for Tumor Necrosis Factor-Alpha, Process for Removing the Same, and Adsorber for the Same Using the Adsorbent
Patent: 6,127,528 →
Application: 09/283,964 →
Polyimide Compositions
Patent: 6,303,742 →
Application: 09/424,925 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Address Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →