Patent Assignment
Reel/Frame 032066/0070
Assignment of Assignor's Interest
Recorded: 2014-01-28
Pages: 3
Assignors
LEE, CHIEN-HSUN
Executed: 2014-01-21
WANG, TSUNG-DING
Executed: 2014-01-20
LII, MIRNG-JI
Executed: 2014-01-21
YU, CHEN-HUA
Executed: 2014-01-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packages with Stacked Dies and Methods of Forming the Same