Patent Assignment
Reel/Frame 032071/0588
Assignment of Assignor's Interest
Recorded: 2013-12-16
Pages: 2
Assignor
KIM, BONG SOO
Executed: 2013-12-12
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
150, MAEYEONG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Embedded Substrate and Method of Manufacturing Electronic Component Embedded Substrate