IP Library Assignment 032106/0975
Patent Assignment
Reel/Frame 032106/0975

Assignment of Assignor's Interest

Recorded: 2014-01-31 Pages: 10
Assignors
SCHWEIKERT, PAUL
Executed: 2014-01-28
SHARPE, ANDREW
Executed: 2014-01-10
CARLSON, GREGORY A.
Executed: 2014-01-31
MATSON, ALEX
Executed: 2014-01-27
VILANDER, SCOTT
Executed: 2014-01-29
ZAHUTA, BOB
Executed: 2014-01-31
GOEDEN, RICHARD M.
Executed: 2014-01-28
Assignee
FLIR SYSTEMS, INC.
27700 SW PARKWAY AVENUE, WILSONVILLE, OREGON, 97070
Covered Property (1)
Wafer Level Packaging of Microbolometer Vacuum Package Assemblies
Patent: 9,741,591 →
Application: 14/141,300 →
Publication: US 2014/0186999
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Nov 24, 2021
From: FLIR SYSTEMS, INC.; FIREWORK MERGER SUB II, LLC
To: TELEDYNE FLIR, LLC
Reel/Frame 058832/0915 →