Patent Assignment
Reel/Frame 032159/0568
Assignment of Assignor's Interest
Recorded: 2014-02-06
Pages: 11
Assignors
THACKER, HIREN D.
Executed: 2013-10-07
LIU, FRANKIE Y.
Executed: 2013-10-07
HOPKINS, ROBERT DAVID, II
Executed: 2013-10-07
LEXAU, JON
Executed: 2013-10-07
ZHENG, XUEZHE
Executed: 2013-10-07
LI, GUOLIANG
Executed: 2013-10-09
SHUBIN, IVAN
Executed: 2013-10-07
HO, RONALD
Executed: 2013-10-07
CUNNINGHAM, JOHN E.
Executed: 2013-10-07
KRISHNAMOORTHY, ASHOK V.
Executed: 2013-10-07
Assignee
ORACLE INTERNATIONAL CORPORATION
500 ORACLE PARKWAY, MAIL STOP 5OP7, REDWOOD CITY, CALIFORNIA, 94065
Covered Property
(1)
Hybrid-Integrated Photonic Chip Package with an Interposer