Patent Assignment
Reel/Frame 032184/0340
Assignment of Assignor's Interest
Recorded: 2014-02-10
Pages: 2
Assignor
LIU, JIANHUA
Executed: 2014-02-07
Assignee
ADVANCED SEMICONDUCTOR MANUFACTURING CO. LTD.
385 HONGCAO ROAD, SHANGHAI, 200233, CHINA
Covered Property
(1)
Eeprom Core Structure Embedded into Bcd Process and Forming Method Thereof