Patent Assignment
Reel/Frame 032199/0242
Assignment of Assignor's Interest
Recorded: 2014-02-12
Pages: 4
Assignors
UNO, TAKASHI
Executed: 2013-08-23
IKEDA, HIKARU
Executed: 2013-09-02
YAHATA, KAZUHIRO
Executed: 2013-08-23
IWATA, MOTOYOSHI
Executed: 2013-08-26
NAITOU, HIROSHI
Executed: 2013-08-26
KAMIYAMA, TOMOHIDE
Executed: 2013-08-23
Assignee
PANASONIC CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Package, Method and Mold for Producing Same, Input and Output Terminals of Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.