Patent Assignment
Reel/Frame 032204/0682
Assignment of Assignor's Interest
Recorded: 2014-02-12
Pages: 3
Assignors
CHENG, KUO-YU
Executed: 2014-01-23
TSAI, WEI-KUNG
Executed: 2014-01-23
TSAI, KUAN-CHI
Executed: 2014-01-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Structure with Metal Ring on Silicon-on-Insulator (Soi) Substrate