Patent Assignment
Reel/Frame 032227/0037
Assignment of Assignor's Interest
Recorded: 2014-02-10
Pages: 3
Assignor
KIMURA, NORIYUKI
Executed: 2014-02-05
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, JAPAN
Covered Property
(1)
Resin-Encapsulated Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.