IP Library › Assignment 032228/0724
Patent Assignment
Reel/Frame 032228/0724

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2014-02-17 Received: 2014-02-17 Pages: 7
Assignor
TESSERA RESEARCH LLC
Executed: 2011-09-08
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Applications (2)
CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING
App. No. 14/162,011
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METHODS OF MANUFACTURING ACOUSTICAL SOUND PROOFING MATERIALS WITH OPTIMIZED FRACTURE CHARACTERISTICS
App. No. 12/117,687
→