Patent Assignment
Reel/Frame 032239/0086
Assignment of Assignor's Interest
Recorded: 2014-02-11
Pages: 3
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Electronic Device Package Structure and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.