Patent Assignment
Reel/Frame 032249/0143
Assignment of Assignor's Interest
Recorded: 2014-02-19
Pages: 2
Assignors
NASIRI, STEVEN S.
Executed: 2005-03-18
FLANNERY, ANTHONY FRANCIS, JR.
Executed: 2005-03-18
Assignee
INVENSENSE, INC.
1745 TECHNOLOGY DRIVE, SAN JOSE, CALIFORNIA, 95110
Covered Property
(1)
Method of Fabrication of Ai/Ge Bonding in a Wafer Packaging Environment and a Product Produced Therefrom