Patent Assignment
Reel/Frame 032270/0853
Assignment of Assignor's Interest
Recorded: 2014-02-21
Pages: 2
Assignor
WANG, HAIDONG
Executed: 2012-09-04
Assignee
HANGZHOU H3C TECHNOLOGIES CO., LTD.
HUAWEI HANGZHOU MANUFACTURING BASE, 310 LIUHE ROAD, ZHIJIANG HI-TECH PARK, HANGZHOU HI-TECH INDUSTRY DEVELOPMENT ZONE, HANGZHOU, ZHEJIANG, 310053, CHINA
Covered Property
(1)
Method for Bundling Cross-Board Multilink Protocol
Application:
14/240,184 →
Publication:
US 2014/0226679
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.