Patent Assignment
Reel/Frame 032303/0523
Assignment of Assignor's Interest
Recorded: 2014-02-26
Pages: 4
Assignors
OSENBACH, JOHN W.
Executed: 2014-02-24
CROUTHAMEL, DAVID L.
Executed: 2014-02-24
EMERICH, SUZANNE M.
Executed: 2014-02-24
CATE, STEVEN
Executed: 2014-02-21
Assignee
LSI CORPORATION
1320 RIDDER PARK DRIVE, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Method for Flip-Chip Bonding Using Copper Pillars
Application:
14/190,659 →
Publication:
US 2015/0243617
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Assignment of Assignor's Interest
Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →