Patent Assignment
Reel/Frame 032305/0672
Assignment of Assignor's Interest
Recorded: 2014-02-26
Pages: 2
Assignor
YANG, KI HONG
Executed: 2014-01-22
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnection Structure Including Air Gap, Semiconductor Device Including Air Gap, and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.