Patent Assignment
Reel/Frame 032320/0221
Assignment of Assignor's Interest
Recorded: 2014-02-28
Pages: 4
Assignors
LIU, PING-YIN
Executed: 2014-02-19
KUANG, HSUN-CHUNG
Executed: 2014-02-19
HSIAO, CHENG-TAI
Executed: 2014-02-19
HUANG, XIN-HUA
Executed: 2014-02-19
CHAO, LAN-LIN
Executed: 2014-02-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Bonding Process and Structure