Patent Assignment
Reel/Frame 032323/0759
Assignment of Assignor's Interest
Recorded: 2014-02-28
Pages: 4
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Method of Packaging a Semiconductor Chip Using a 3D Printing Process and Semiconductor Package Having Angled Surfaces