IP Library Assignment 032356/0581
Patent Assignment
Reel/Frame 032356/0581

Assignment of Assignor's Interest

Recorded: 2014-03-05 Pages: 14
Assignors
YAMAGUCHI, YOSHITAKA
Executed: 2013-12-24
IWAI, TAISUKE
Executed: 2014-01-06
NORIMATSU, MASAAKI
Executed: 2013-12-25
SAKITA, YUKIE
Executed: 2013-12-24
HIROSE, SHINICHI
Executed: 2013-12-25
YAGISHITA, YOHEI
Executed: 2013-12-24
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property (1)
Heat Dissipation Material and Method of Manufacturing Thereof, and Electronic Device and Method of Manufacturing Thereof
Patent: 9,635,784 →
Application: 14/166,109 →
Publication: US 2014/0140008
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
Assignment of Assignor's Interest Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →