Patent Assignment
Reel/Frame 032391/0050
Assignment of Assignor's Interest
Recorded: 2014-03-10
Pages: 4
Assignors
BAE, WOO-JIN
Executed: 2014-03-05
HONG, SUNG WOO
Executed: 2014-03-05
SOHN, BYUNG HEE
Executed: 2014-03-05
CHANG, WON SUK
Executed: 2014-03-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Polyimide Precursor Composition, Method for Preparing Polyimide, Polyimide Prepared by Using the Method, and Film Including the Polyimide