Patent Assignment
Reel/Frame 032400/0454
Assignment of Assignor's Interest
Recorded: 2014-03-11
Pages: 3
Assignor
CHEN, SHIH-WEI
Executed: 2014-03-04
Assignee
TSMC SOLAR LTD.
NO. 5, KEYA W. ROAD, DAYA DISTRICT, TAICHUNG CITY, 428-82, TAIWAN
Covered Property
(1)
Method for Removing Non-Bonding Compound from Polycrystalline Materials on Solar Panel
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.