Patent Assignment
Reel/Frame 032403/0014
Assignment of Assignor's Interest
Recorded: 2014-03-11
Pages: 6
Assignors
TOZAWA, TOMOKAZU
Executed: 2014-01-28
IWAHARA, TAKAHISA
Executed: 2014-01-28
OGOSHI, HIROSHI
Executed: 2014-01-28
HIRABAYASHI, KAZUHIKO
Executed: 2014-01-28
OZAKI, SHUHEI
Executed: 2014-01-28
IBA, SATOAKI
Executed: 2014-01-28
KANAI, KAZUAKI
Executed: 2014-01-28
KAKEHASHI, YASUSHI
Executed: 2014-01-28
MANABE, TAKAO
Executed: 2014-01-28
HORI, MITSUHIRO
Executed: 2014-01-28
NARITA, RYOICHI
Executed: 2014-01-28
Assignee
KANEKA CORPORATION
2-3-18, NAKANOSHIMA, KITA-KU, OSAKA-SHI, OSAKA, 530-8288, JAPAN
Covered Property
(1)
Molded Resin Body for Surface-Mounted Light-Emitting Device, Manufacturing Method Thereof, and Surface-Mounted Light-Emitting Device