Patent Assignment
Reel/Frame 032419/0252
Assignment of Assignor's Interest
Recorded: 2014-03-12
Pages: 11
Assignors
OHIRA, HIKARU
Executed: 2014-02-19
OWADA, TAMOTSU
Executed: 2014-02-24
OCHIMIZU, HIROSATO
Executed: 2014-02-14
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method of Semiconductor Device
Application:
14/206,545 →
Publication:
US 2014/0306339