Patent Assignment
Reel/Frame 032432/0064
Assignment of Assignor's Interest
Recorded: 2014-03-13
Pages: 7
Assignors
SAKAMOTO, SHINICHI
Executed: 2014-02-24
CHENG, ZHIGANG
Executed: 2014-03-06
CHAN MOCK, FERNANDO
Executed: 2014-03-06
KAWARAI, MITSUGU
Executed: 2014-02-24
Assignee
SUMIDA CORPORATION
SUITENGU HOKUSHIN BUILDING, 1-39-5, NIHONBASHI KAKIGARA-CHO, CHUO-KU, TOKYO, 103-8589, JAPAN
Covered Property
(1)
Electronic Component and Method for Manufacturing Electronic Component