Patent Assignment
Reel/Frame 032434/0001
Assignment of Assignor's Interest
Recorded: 2014-03-13
Pages: 2
Assignors
CHU, MING-HUI
Executed: 2014-03-07
TING, CHIH-YUAN
Executed: 2014-03-07
SHIEH, JYU-HORNG
Executed: 2014-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure and Method of Forming Same