IP Library › Assignment 032435/0301
Patent Assignment
Reel/Frame 032435/0301

Assignment of Assignor's Interest

Recorded: 2014-03-14 Pages: 3
Assignors
NAKATANI, SEIICHI
Executed: 2013-10-30
KAWAKITA, KOJI
Executed: 2013-10-28
SAWADA, SUSUMU
Executed: 2013-10-28
YAMASHITA, YOSHIHISA
Executed: 2013-10-30
Assignee
PANASONIC CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Built-Up Substrate, Method for Manufacturing Same, and Semiconductor Integrated Circuit Package
Patent: 9,236,338 →
Application: 14/122,323 →
Publication: US 2014/0124777
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
Corrective Assignment to Correct the Erroneously Filed Application Numbers 13/384239, 13/498734, 14/116681 and 14/301144 Previously Recorded on Reel 034194 Frame 0143. Assignor(S) Hereby Confirms the Assignment. Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →