Patent Assignment
Reel/Frame 032447/0512
Assignment of Assignor's Interest
Recorded: 2014-03-14
Pages: 6
Assignors
SHEN, HONG
Executed: 2014-03-14
WOYCHIK, CHARLES G.
Executed: 2014-03-14
ARKALGUD, SITARAM R.
Executed: 2014-03-14
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Circuits Protected by Substrates with Cavities, and Methods of Manufacture
Application:
14/214,365 →
Publication:
US 2015/0262902
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →