IP Library Assignment 032480/0516
Patent Assignment
Reel/Frame 032480/0516

Assignment of Assignor's Interest

Recorded: 2014-03-20 Pages: 3
Assignors
GODFREY, LAWRENCE ALLEN
Executed: 2014-03-17
BARLOW, ARTHUR JOHN
Executed: 2014-03-16
Assignee
EXCELITAS CANADA, INC.
22001 DUMBERRY ROAD, VAUDREUIL-DORION, J7V 8P7, CANADA
Covered Property (1)
Reduced Thickness and Reduced Footprint Semiconductor Packaging
Patent: 9,117,721 →
Application: 14/220,167 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 12, 2022
From: EXCELITAS CANADA INC.
To: GOLUB CAPITAL MARKETS LLC, AS COLLATERAL AGENT
Reel/Frame 061161/0079 →