Patent Assignment
Reel/Frame 032502/0942
Assignment of Assignor's Interest
Recorded: 2014-03-23
Pages: 2
Assignors
CHENG, JUNG WEI
Executed: 2014-02-18
WANG, TSUNG-DING
Executed: 2014-02-18
LII, MIRNG-JI
Executed: 2014-02-18
LEE, CHIEN-HSUN
Executed: 2014-02-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Thermal Performance Structure for Semiconductor Packages and Method of Forming Same