Patent Assignment
Reel/Frame 032536/0277
Assignment of Assignor's Interest
Recorded: 2014-03-26
Pages: 9
Assignors
LEE, DONG HWAN
Executed: 2013-08-26
PARK, SEUNG WOOK
Executed: 2013-08-26
ROMERO, CHRISTIAN
Executed: 2013-08-26
KWEON, YOUNG DO
Executed: 2013-08-29
KIM, JIN GU
Executed: 2013-08-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
150, MAEYEONG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Via Structure Having Open Stub and Printed Circuit Board Having the Same