IP Library Assignment 032539/0169
Patent Assignment
Reel/Frame 032539/0169

Assignment of Assignor's Interest

Recorded: 2014-03-27 Pages: 3
Assignor
INFINEON TECHNOLOGIES AG
Executed: 2003-07-16
Assignees
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, MUENCHEN, 81669, GERMANY
UNITED MICRO ELECTRONICS CO
NO. 3. LI-HSIN ROAD 2, SCIENCE BASE INDUSTRIAL PARK, ROC HSIN-CHU CITY, 30077, TAIWAN
Covered Property (1)
Stacked Mimcap Between Cu Dual Damascene Levels
Patent: 6,677,635 →
Application: 09/870,499 →
Publication: US 2002/0182794
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 1, 2002
From: NING, XIAN J.; HSIEH, YI SHENG
To: INFINEON TECHNOLOGIES, NORTH AMERICA CORP.
Reel/Frame 012571/0001 →
Assignment of Assignor's Interest Jun 6, 2003
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 013715/0612 →