IP Library › Assignment 032541/0299
Patent Assignment
Reel/Frame 032541/0299

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2014-03-27 Received: 2014-03-27 Pages: 5
Assignors
DO, BYUNG TAI
Executed: 2014-03-12
KIM, SUNG SOO
Executed: 2014-03-12
TRASPORTO, ARNEL SENOSA
Executed: 2014-03-12
YOON, IN SANG
Executed: 2014-03-12
YUSOF, ASRI
Executed: 2014-03-12
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications (2)
CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
App. No. 14/214,765
→
CORE AND CARRIERLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE THEREOF
App. No. 61/804,158
→