Patent Assignment
Reel/Frame 032547/0277
Assignment of Assignor's Interest
Recorded: 2014-03-28
Pages: 8
Assignors
BURRIS, MARCY N.
Executed: 2004-12-02
MAHDI, SYED Z.
Executed: 2004-12-03
HENDERSON, MICHELLE M.
Executed: 2005-03-22
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Method of Primerless Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
Change of Legal Entity
Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
Assignment of Assignor's Interest
Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →