IP Library › Assignment 032636/0662
Patent Assignment
Reel/Frame 032636/0662

Assignment of Assignor's Interest

Recorded: 2014-04-09 Pages: 7
Assignor
HUANG, BOBBY
Executed: 2012-10-12
Assignees
ST-ERICSSON SA
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, 1228, SWITZERLAND
SHANGHAI NF SEMICONDUCTORS TECHNOLOGY LTD
SUITE 111 FLOOR 1, BUILDING 14 695, LINGSHROAD, ZHABEI DISTRICT, SHANGHAI, 200070, CHINA
Covered Property (1)
Multi-Master Bus Architecture for System-On-Chip
Patent: 9,104,819 →
Application: 13/509,945 →
Publication: US 2013/0046909
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 9, 2014
From: SHANGHAI NF SEMICONDUCTORS TECHNOLOGY LTD
To: ST-ERICSSON SA
Reel/Frame 032636/0878 →
Status Change-Entity in Liquidation Feb 2, 2016
From: ST-ERICSSON SA
To: ST-ERICSSON SA, EN LIQUIDATION
Reel/Frame 037739/0493 →
Assignment of Assignor's Interest Mar 5, 2019
From: ST-ERICSSON SA, EN LIQUIDATION
To: OPTIS CIRCUIT TECHNOLOGY, LLC,
Reel/Frame 048504/0519 →
Assignment of Assignor's Interest Mar 7, 2019
From: OPTIS CIRCUIT TECHNOLOGY, LLC,
To: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
Reel/Frame 048529/0510 →