Assignment of Assignor's Interest

Recorded: 2014-04-10 Pages: 3

Assignors

OHNUKI, KOHJI

Executed: 2012-03-28

YASUDA, YORITAKA

Executed: 2012-03-28

OZAKI, TARO

Executed: 2012-03-28

Assignee

DAISO CO., LTD.

12-18, AWAZA 1-CHOME, NISHI-KU, OSAKA-SHI, 550-0011, JAPAN

Covered Property (1)

Composition for Semiconductive Rubber, Crosslinked Rubber Product, and Semiconductive Parts

Patent: 8,735,503 →

Application: 13/501,725 →

Publication: US 2012/0208966

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.