Patent Assignment
Reel/Frame 032659/0950
Assignment of Assignor's Interest
Recorded: 2014-04-11
Pages: 3
Assignors
GOHARA, HIROMICHI
Executed: 2014-04-03
MOROZUMI, AKIRA
Executed: 2014-04-07
ICHIMURA, TAKESHI
Executed: 2014-04-07
Assignee
FUJI ELECTRIC CO., LTD.
1-1 TANABESHINDEN, KAWASAKI-KU, KAWASAKI-SHI, 210-9530, JAPAN
Covered Property
(1)
Cooling Device for Semiconductor Module, and Semiconductor Module