Patent Assignment
Reel/Frame 032666/0416
Assignment of Assignor's Interest
Recorded: 2014-04-14
Pages: 4
Assignors
LEE, BUMRO
Executed: 2014-01-20
KIM, SEOK-WOONG
Executed: 2014-01-20
MOON, SANGKU
Executed: 2014-01-20
LEE, KYU-HWAN
Executed: 2014-01-20
Assignee
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
644-1, JINPYEONG-DONG, GUMI-SI, GYEONGSANGBUK-DO, 730-735, KOREA, REPUBLIC OF
Covered Property
(1)
Glass Substrate Protective Pad and Glass Substrate Packing Container
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.