Patent Assignment
Reel/Frame 032668/0209
Assignment of Assignor's Interest
Recorded: 2014-04-14
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-04-08
YEE, KUO-CHUNG
Executed: 2014-04-08
LII, MIRNG-JI
Executed: 2014-04-08
LEE, CHIEN-HSUN
Executed: 2014-04-08
WU, JIUN YI
Executed: 2014-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD., 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Methods of Forming Same