IP Library Assignment 032670/0150
Patent Assignment
Reel/Frame 032670/0150

Assignment of Assignor's Interest

Recorded: 2014-04-14 Pages: 2
Assignor
ZOMMER, NATHAN
Executed: 2012-06-05
Assignee
IXYS CORPORATION
1590 BUCKEYE DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Solderless Die Attach to a Direct Bonded Aluminum Substrate
Patent: 9,111,782 →
Application: 14/252,740 →
Publication: US 2014/0225267
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Mar 31, 2018
From: IXYS CORPORATION; IXYS, LLC
To: IXYS, LLC
Reel/Frame 045406/0630 →
Assignment of Assignor's Interest May 1, 2019
From: IXYS, LLC
To: LITTELFUSE, INC.
Reel/Frame 049056/0649 →