Patent Assignment
Reel/Frame 032682/0837
Assignment of Assignor's Interest
Recorded: 2014-04-16
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-04-11
JENG, SHIN-PUU
Executed: 2014-04-11
CHEN, HSIEN-WEI
Executed: 2014-04-11
YEH, DER-CHYANG
Executed: 2014-04-11
SU, AN-JHIH
Executed: 2014-04-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packages and Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices