Patent Assignment
Reel/Frame 032705/0794
Assignment of Assignor's Interest
Recorded: 2014-04-18
Pages: 2
Assignors
DE SAMBER, MARK ANDRE
Executed: 2013-01-10
VAN GRUNSVEN, ERIC CORNELIS EGBERTUS
Executed: 2013-01-11
ENGELEN, ROY ANTOIN BASTIAAN
Executed: 2013-01-11
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5, EINDHOVEN, 5656AE, NETHERLANDS
Covered Property
(1)
Low Warpage Wafer Bonding Through Use of Slotted Substrates
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Assignment of Assignor's Interest
Nov 27, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044809/0940 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →