Assignment of Assignor's Interest

Recorded: 2014-04-30 Pages: 3

Assignors

NAKAZAWA, CHIHARU

Executed: 2013-03-26

MISUNOU, MASAKI

Executed: 2014-03-31

Assignee

HITACHI AUTOMOTIVE SYSTEMS, LTD.

2520, TAKABA, HITACHINAKA-SHI, IBARAKI, 312-8503, JAPAN

Covered Property (1)

Sealing for a Pump Device

Patent: 9,709,056 →

Application: 14/355,397 →

Publication: US 2014/0294649

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.