Patent Assignment
Reel/Frame 032854/0492
Assignment of Assignor's Interest
Recorded: 2014-05-09
Pages: 3
Assignor
CHUN, SUNG WOOK
Executed: 2014-05-09
Assignee
YMT CO., LTD.
30, NAMDONGDONG-RO 153BEON-GIL, NAMDONG-GU, INCHEON, 405-819, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Producing Substrate Formed with Copper Thin Layer, Method for Manufacturing Printed Circuit Board and Printed Circuit Board Manufactured Thereby