Patent Assignment
Reel/Frame 032867/0356
Assignment of Assignor's Interest
Recorded: 2014-05-12
Pages: 3
Assignors
BRECH, HELMUT
Executed: 2014-03-13
ZIGLDRUM, MATTHIAS
Executed: 2014-03-13
BIRNER, ALBERT
Executed: 2014-03-13
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Power Transistor Die with Capacitively Coupled Bond Pad
Application:
14/186,840 →
Publication:
US 2015/0243649
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2014
From: WILSON, RICHARD; GOEL, SAURABH
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 032873/0936 →
Assignment of Assignor's Interest
Dec 22, 2014
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 034563/0042 →