Patent Assignment
Reel/Frame 032887/0612
Assignment of Assignor's Interest
Recorded: 2014-05-14
Pages: 5
Assignors
HUANG, YU-FEI
Executed: 2014-04-15
LI, MING XIANG
Executed: 2014-04-15
WAN, EDWARD
Executed: 2014-04-15
CHEN, JACOB
Executed: 2014-04-15
YAUNG, DUN-NIAN
Executed: 2014-04-17
CHEN, CHENG-ENG DANIEL
Executed: 2014-04-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Via Interconnect Structure and Method of Manufacture