Patent Assignment
Reel/Frame 032965/0766
Assignment of Assignor's Interest
Recorded: 2014-05-27
Pages: 3
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
FOUNDERPCB INDUSTRY PARK, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Property
(1)
Substrates With Ultra Fine Pitch Flip Chip Bumps
Application:
14/150,683 →
Publication:
US 2015/0195912