IP Library › Assignment 032974/0348
Patent Assignment
Reel/Frame 032974/0348

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2014-05-28 Received: 2014-05-28 Pages: 3
Assignors
CHIA, LAI YEE
Executed: 2014-05-27
NA, DUK JU
Executed: 2014-05-27
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications (2)
SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADHESIVE LAYER OVER INSULATING LAYER FOR BONDING CARRIER TO MIXED SURFACES OF SEMICONDUCTOR DIE AND ENCAPSULANT
App. No. 14/288,643
→
META CROSSLINKED BENZYL POLYMERS
App. No. 13/499,387
→