Assignment of Assignor's Interest

Recorded: 2014-05-30 Pages: 4

Assignor

MIYASHITA, TOSHIHIKO

Executed: 2014-05-07

Assignee

FUJITSU SEMICONDUCTOR LIMITED

2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device Including Trench Embedded with Semiconductor Layer

Patent: 9,093,553 →

Application: 14/258,249 →

Publication: US 2014/0227838

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.