IP Library Assignment 033062/0387
Patent Assignment
Reel/Frame 033062/0387

Assignment of Assignor's Interest

Recorded: 2014-06-10 Pages: 3
Assignors
DU, YANG
Executed: 2014-06-04
ARABI, KARIM
Executed: 2014-06-05
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) AND RELATED SYSTEMS
Patent: 9,343,369 →
Application: 14/280,731 →
Publication: US 2015/0333056